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ZYWYN CORPORATION
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Reliability Qualification Report Interface Product Family ZT3223E Series ZT230E Series ZT232E Series ZT485E Series ZT3485E Series
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Table of Contents Title Page Table of Contents Life Test * ZT3223E Series www..com * ZT230E Series * ZT232E Series * ZT485E Series * ZT3485E Series Fit Rate Calculation ESD Test * ZT3223E Series * ZT230E Series * ZT232E Series * ZT485E Series * ZT3485E Series
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Reliability Test 12-14 * For Standard Packages 8L,16L, 20L, 24L, & 28L (PDIP, MSOP, SOP & TSSOP) *Test Flow *Environmental Stress/Mechanical Tests *Sample Information & Reliability Test Data
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* For Green Packages
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(8LSOP-6600CSP, 8L SOP-G600, 16LSSOP-Sn-Bi, 20L TSSOP-G700,28L TSSOP-Sn-Bi, 28L SSOP-6600CSP, 28L SSOP-G600, 28L SOP-G600, 28L SOPSn-Bi) *Green Package Information Table *Green Package BOM Table Summary *IR Reflow profile conditions *Product Environmental Material Declaration Datasheets on Lead-Free and RoHS By Packages *Green Packages Certificate 20 21 22
Appendix 1: Burn-in Board and Burn-in Equipment Appendix 2: ESD Tester Equipment Appendix 3: Reliability Test Report for PB-Free/Green Packages from Lingsen
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Reliability Life Test Result
Life Test Life Testing is performed to determine if device has any fundamental reliability related failure mechanisms, which can be divided into 4 main groups: * Process or die related failures, such as oxide-related defects, metallizationrelated defects and diffusion-related defects. * Assembly-related defects such as wire bonding or package-related failures. * Design-related defects. * Miscellaneous, undetermined or application-induced failures.
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Life Test Result Product Family: Device Type: ZT3223E Low Power 3V to 5.5V RS232 Transceiver ZT3220E/ZT3221E/ZT3222E/ZT3223E/ZT3232E ZT1385E/ZT3241E/ZT3243E ZT3220F/ZT3221F/ZT3222F/ZT3223F/ZT3232F ZT1385F/ZT3241F/ZT3243F MS101 Zywyn 2m CMOS SC2 Technology 20L TSSOP 84-1LMISR4 1.0 mil AU HTOL 1,000 hrs, 3.3V Dynamic Burn-In at 125C Mil-Std-883 Electrical QA testing to datasheet limits at 25C before and after stress.
Lot Number B3609F52V Date Completed 11/26/04 Burn-In Temperature (C) 125 Sample Size 20 No. of Fails 0
Mask Sets: Process: Package Type: Die Attach Adhesive: Bond Wire: Test: Reference Standard: Pass/Fail Criteria:
Device Type
HTOL Test
ZT3223ECY 1,000 hr @ 3.3V
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Life Test Result Product Family: Device Type: Mask Sets: Process: Package Type: Die Attach Adhesive: Bond Wire: www..com Test: Reference Standard: Pass/Fail Criteria: ZT232E Lower Power 5V RS232 Transceiver ZT202E/ZT232E/ZT310E/ZT312E ZT202F/ZT232F/ZT310F/ZT312F MS143 Zywyn 2m CMOS SC2 Technology 16L TSSOP, 16L nSOIC 84-1LMISR4 1.0 mil AU HTOL 1,000 hrs, 5.0V Dynamic Burn-In at 125C Mil-Std-883 Electrical QA testing to datasheet limits at 25C before and after stress.
Lot Number B4405210C B4405210C Date Completed 01/07/05 01/07/05 Burn-In Temperature (C) 125 125 Sample Size 10 10 No. of Fails 0 0
Device Type ZT232EEY ZT232ECN
HTOL Test 1,000 hr @ 5.0V 1,000 hr @ 5.0V
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Life Test Result Product Family: Device Type: Mask Sets: Process: Package Type: Die Attach Adhesive: Bond Wire: www..com Test: Reference Standard: Pass/Fail Criteria: ZT230E Lower Power 5V RS232 Transceiver ZT207E/ZT208E/ZT211E/ZT213E ZT207F/ZT208F/ZT211F/ZT213F MS107 Zywyn 2m CMOS SC2 Technology 24L SSOP 84-1LMISR4 1.0 mil AU HTOL 1,000 hrs, 5.0V Dynamic Burn-In at 125C Mil-Std-883 Electrical QA testing to datasheet limits at 25C before and after stress.
Lot Number B3929P08G Date Completed 01/07/05 Burn-In Temperature (C) 125 Sample Size 20 No. of Fails 0
Device Type ZT213ECA
HTOL Test 1,000 hr @ 5.0V
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Life Test Result Product Family: Device Type: Mask Sets: Process: Package Type: Die www..com Attach Adhesive: Bond Wire: Test: Reference Standard: Pass/Fail Criteria: ZT485E Lower Power 5V RS485 Transceiver ZT483E/ZT485E/ZT488E/ZT489E/ZT490E/ZT491E/ ZT487E/ZT485ER/ZT488ER/ZT489ER/ZT490ER/ ZT491ER/ZT483H/ZT485H MS127 Zywyn 2m CMOS SC2 Technology 8L PDIP AG03*7 1.0 mil AU HTOL 1,000 hrs, 5.0V Dynamic Burn-In at 125C Mil-Std-883 Electrical QA testing to datasheet limits at 25C before and after stress.
Lot Number Date Completed 01/07/05 Burn-In Temperature (C) 125 Sample Size 20 No. of Fails 0
Device Type ZT483EEP
HTOL Test
1,000 hr B3B27H50Q @ 5.0V
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Life Test Result Product Family: Device Type: Mask Sets: Process: Package Type: Die www..com Attach Adhesive: Bond Wire: Test: Reference Standard: Pass/Fail Criteria: ZT3485E Lower Power 3V RS485 Transceiver ZT3483E/ZT3485E/ZT3488E/ ZT3490E/ZT3491E/ ZT3070E/ZT3071E/ZT3072E/ZT3073E/ZT3074E/ ZT3075E/ZT3076E/ZT3077E/ZT3078E MS157 Zywyn 2m CMOS SC2 Technology 8L nSOIC AG03*7 1.0 mil AU HTOL 1,000 hrs, 3.3V Dynamic Burn-In at 125C Mil-Std-883 Electrical QA testing to datasheet limits at 25C before and after stress.
Lot Number B5711181C Date Completed 03/29/06 Burn-In Temperature (C) 125 Sample Size 10 No. of Fails 0
Device Type ZT3483E
HTOL Test 1,000 hr @ 3.3V
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FIT Rate Calculation
The FIT (failures in time) is the calculated as follows, FR (Chi-squared) = 22n+2 / (2 x AF x device-hours) x 109 where AF is the acceleration factor and n is the number of failures. The value is highly dependent on the following: 1. Life test conditions (duration, temperature, sample size and number of failures) 2. Activation energy of the potential failure modes
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The weighted activation energy, Ea, of observed failure mechanisms of Zywyn products has been determined to be 0.8eV. Based on the above criteria, the FIT rates at 25C, 55C, and 70C operation at both 60% and 90% confidence levels for Zywyn's ZT3223E products have been calculated and are listed below.
ZT3223E/ZT232E/ZT213E/ZT485E Confidence Level +25C 60% 45.9 90% 18.3 1 FIT = 1 failure per billion device hours
+55C 792.9 315.6
+75C 4033.6 1605.5
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ESD Test Results
Summary: ZT3223E Series
Device Type ZT3223ECY ESD Test Lot Number 15kV B3609F52V Air Gap Discharge ZT3223ECY 8kV B3609F52V Contact www..com Discharge Date Completed 06/15/04 06/15/04 Sample Size 14 14 No. of Fails 0 0
ZT232E Series
Device Type ZT232ECN ZT232ECN ESD Test Lot Number 15kV B4405210C Air Gap Discharge 8kV B4405210C Contact Discharge ESD Test Lot Number Date Completed 08/05/04 08/05/04 Sample Size 14 14 No. of Fails 0 0
ZT230E Series
Device Type ZT213ECA ZT213ECA 15kV B3929P08G Air Gap Discharge 8kV B3929P08G Contact Discharge ESD Test Lot Number Date Completed 10/11/04 10/11/04 Sample Size 14 14 No. of Fails 0 0
ZT485E Series
Device Type ZT483EEP ZT483EEP 15kV B3B27H50Q Air Gap Discharge 8kV B3B27H50Q Contact Discharge Date Completed 11/25/04 11/25/04 Sample Size 14 14 No. of Fails 0 0
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ZT3485E Series
Device Type ZT3485LEEN ESD Test Lot Number 15kV B5711181C Air Gap Discharge ZT3485LEEN 8kV B5711181C Contact Discharge
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Date Completed 02/20/06 02/20/06
Sample Size 14 14
No. of Fails 0 0
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Lead-Free Package & Green Package
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Pin # 28L 28L 28L 28L 28L 20L 16L 8L 8L
Package Type TSSOP SSOP SSOP SOP SOP TSSOP SSOP SOP SOP
Plating Sn/Bi 98/2 Sn/Bi 98/2 Sn/Bi 98/2 Sn/Bi 98/2 N/A N/A Sn/Bi 98/2 Sn/Bi 98/2 Pb-free
Molding Lead Frame Silver Epoxy Gold Wire Compound 5.0X2.9, C7025AG 8340 NI-5 1.0 mil EME-7372 84X19, C151AG 8340 NL-5 1.2 mil EME-6600CS-P 84X19 8340 NL-5 1.2 mil EME-G600 163X200, C194AG 8340 NL-5 1.2 mil EME-G600 116X90, C194AG 8340A NL-5 1.0 mil EME-6600CS-P 165X118, C7025AG CRM-1033BF-IMP SGL-2 1.0 mil EME-G6700 90X90, C194AG CRM-1033BF-IMP NL-5 1.2 mil EME-G600 80X80, C194AG 8340 NL-5 1.2 mil EME-6600CS-P 80X80, C194AG 8340 NL-5 1.2 mil EME-G600
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Green Package BOM for Interface Products
Bil Of Material Package Types
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Standard Sn-Pb Package
SSOP/SOIC TSSOP MSOP PDIP SOT SSOP/SOIC TSSOP
Pb-free Package
MSOP PDIP SOT
Green Package
SSOP, SOIC, PDIP, TSSOP, MSOP SOT Per device bonding diagram drawing 1.0 mil Au Wire CRM-1033BF EME-G600 EME-G700
Lead Frame Au Wire Silver Paste Molding Compound Lead Finish Ink Tube/Tray Inner/External Box
Per device bonding diagram drawing 1.0 mil Au Wire 84-1LMISR4 EME-6600C SP EME-7372 KMC-184 Sn 85 / Pb 15 4408R White Standard Tube Standard Box AG03*7 84-1LMISR4
Per device bonding diagram drawing 1.0 mil Au Wire CRM-1033BF EME-7372 EME-6600C SP EME-6300H Sn 98 / Bi 2 4408R White Standard Tube Standard Box
EME-1100K EME-6300H EME-6600C SP EME-7372
Sn 98 / Bi 2 4408R White Standard Tube Standard Box with Green Label
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Zywyn Green Packages Are Ready
For Interface Products: All package types from Lingsen Taiwan
www..comReflow Profile Conditions IR
Program Name Peak temperature Pre-heat range/time Time within 5 C of peak temperature Time maintained above temperature/time Time 25 C to peak temperature Ramp-up rate Ramp-down rate
o o
JESD Sn-Pb Eutectic Assembly (small packages) 235~240oC 100~150oC, 60~120 sec. 10~30 sec. 183oC, 60~150 sec. 6 min. max. 3 C/sec. max. 6oC/sec. max.
o
JESD Pb-free Assembly (small packages) o 245~250 C o 150~200 C, 60~180 sec. 20~40 sec. 217 C, 60~150 sec. 8 min. max. 3 C/sec. max. o 6 C/sec. max.
o o
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Product Environmental Material Declaration Datasheets By Package: Package Type
PDIP-08 PDIP-16 nSOIC-14 nSOIC-16 nSOIC-8 SSOP-16 SSOP-20 SSOP-24 SSOP-28 TSSOP-16 TSSOP-20 TSSOP-28 wSOIC-16 wSOIC-24
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Datasheet PDIP-08_MaterialDeclaration.pdf PDIP-16_MaterialDeclaration.pdf nSOIC-14_ MaterialDeclaration.pdf nSOIC-16_ MaterialDeclaration.pdf nSOIC-8_Interface_ MaterialDeclaration.pdf SSOP-16_ MaterialDeclaration.pdf SSOP-20_ MaterialDeclaration.pdf SSOP-16_ MaterialDeclaration.pdf SSOP-28_ MaterialDeclaration.pdf TSSOP-16_ MaterialDeclaration.pdf TSSOP-20_ MaterialDeclaration.pdf TSSOP-28_ MaterialDeclaration.pdf wSOIC-16_ MaterialDeclaration.pdf wSOIC-24_ MaterialDeclaration.pdf
All Product Environmental Material Declaration Datasheets for the Interface Products can be found and downloaded from Zywyn website at www.zywyn.com under "Products", "Technical Reference", "Green Packaging Information" in pdf file format.
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Appendix 1
Burn-in Board and Burn-in Equipment:
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Burn-in Board used for Dynamic Life Test
Burn-in oven used for Dynamic Life and Humidity Test
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Appendix 2
ESD Tester Equipment:
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Front view of the iMCS model#700
Front view of the iMCS model#700 ESD tester with lid open
Back view of the ESD tester with Machine model/Pulse model being used
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Appendix 3 The Reliability Test Reports for the following PB-Free/Green Packages are available upon request: * * * * www..com * * * * * TSSOP 28L PB-Free Package TSSOP 20L Green Package SSOP 28L Lead-Free Package SSOP 16L Lead-Free Package SSOP 28L Green Package SOP 8L Lead-Free Package SOP 28L Green Package SOP 28L Lead-Free Package SOP 8L Green Package
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